Adhesion aspects in MEMS/NEMS
by
Kim, Seong H.
Title
:
Adhesion aspects in MEMS/NEMS
Author
:
Kim, Seong H.
Publication Information
:
Leiden [Netherlands] ; Boston : VSP, 2010.
Physical Description
:
xi, 409 p. : ill.
Contents
:
pt. 1. Understanding through continuum theory -- pt. 2. Computer simulation of interfaces -- pt. 3. Adhesion and friction measurements -- pt. 4. Adhesion in practical applications -- pt. 5. Adhesion mitigation strategies.
Subject Term
:
Microelectromechanical systems.
Nanoelectromechanical systems.
Adhesion.
Surfaces (Technology)
Genre
:
Electronic books.
Added Author
:
Kim, Seong H.
Dugger, M. T. (Michael T.)
Mittal, K. L., 1945-
Added Corporate Author
:
ProQuest (Firm)
Electronic Access
:
| Shelf Number | Item Barcode | Shelf Location | Shelf Location | Holding Information |
|---|
| TK7875 .A34 2010 | 1006704-1001 | Ebook Central | Ebook Central | |