Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
by
 
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

Title
: 
Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Author
: 
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

Corporate Author
: 
National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

Publication Information
: 
Washington, D.C. : National Academy Press ; Alexandria, VA : Available from Defense Technical Information Center, Cameron Station, 1990.

Physical Description
: 
xiv, 139 p. : ill.

General Note
: 
"NMAB-449."

Subject Term
: 
Electronic packaging -- Materials.
 
Electrical engineering -- Materials.

Genre
: 
Electronic books.

Added Corporate Author
: 
ProQuest (Firm)

Electronic Access
: 
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TK7870.15 .N38 19901084219-1001Ebook CentralEbook Central