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      Cover image for Epoxy resins, curing agents, compounds, and modifiers : an industrial guide
      1. 
      Epoxy resins, curing agents, compounds, and modifiers : an industrial guide
      by 
      Flick, Ernest W., author.
      ScienceDirect https://www.sciencedirect.com/science/book/9780815513223
      Format: 
      Excerpt: 
      Epoxy resins, curing agents, compounds, and modifiers : an industrial guide / Flick, Ernest W
      Cover image for The determination of epoxide groups
      2. 
      The determination of epoxide groups
      by 
      Dobinson, B., 1936-
      ScienceDirect http://www.sciencedirect.com/science/book/9780080127880
      Format: 
      Excerpt: 
      Epoxy compounds -- Analysis.
      Cover image for Mechanisms in homogeneous and heterogeneous epoxidation catalysis
      3. 
      Cover image for Bisphenol A Induces Reproductive Toxicity by Antagonizing Cholesterol Uptake at the Star Mitochondrial Transmembrane Transporter in C. elegans
      4. 
      Cover image for Materials for Advanced Packaging
      5. 
      Materials for Advanced Packaging
      by 
      Lu, Daniel. editor.
      http://dx.doi.org/10.1007/978-3-319-45098-8
      Format: 
      Excerpt: 
      Flip chip underfills Epoxy molding compounds Conductive adhesives Die attach adhesives/films Thermal
      Cover image for Medical plastics : degradation resistance & failure analysis
      6. 
      Medical plastics : degradation resistance & failure analysis
      by 
      Portnoy, Robert C.
      ScienceDirect http://www.sciencedirect.com/science/book/9781884207600
      Format: 
      Excerpt: 
      Epoxy Composites -- The Advantages of Utilizing Thermoplastic Polyesters in Medical Devices Subjected to
      Cover image for Powder technology and application III : selected, peer reviewed papers from the 2010 International Forum on Powder Technology & Application, Qingdao China 22-24 July 2010
      7. 
      Powder technology and application III : selected, peer reviewed papers from the 2010 International Forum on Powder Technology & Application, Qingdao China 22-24 July 2010
      by 
      International Forum on Powder Technology & Application (2010 : Qingdao, China)
      Click to View
      Format: 
      Excerpt: 
      Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging / J.G. Zhang -- Research on