Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Title:

Author:

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

Corporate Author:

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

Publication Information:

Washington, D.C. : National Academy Press ; Alexandria, VA : Available from Defense Technical Information Center, Cameron Station, 1990.

Physical Description:

xiv, 139 p. : ill.

General Note:

"NMAB-449."

Subject Term: