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Handbook of thin-film deposition processes and techniques : principles, methods, equipment and applications
Title:
Handbook of thin-film deposition processes and techniques : principles, methods, equipment and applications
Author:
Seshan, Krishna.
ISBN:
9781591241935
9780815517788
9780815517764
9780429076749
9781482269680
9781282253193
9786612253195
9786612253188
Edition:
2nd ed.
Publication Information:
Norwich, N.Y. : Noyes Publications/William Andrew Pub., ©2002.
Physical Description:
1 online resource (xxviii, 629 pages) : illustrations.
Series:
Materials science and process technology series. Electronic materials and process technology
Materials science and process technology series. Electronic materials and process technology.
Contents:
Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index.
Abstract:
The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Subject Term:
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Electronic Access:
ScienceDirect http://www.sciencedirect.com/science/book/9780815514428Available:*
Shelf Number | Item Barcode | Shelf Location | Status |
|---|---|---|---|
| TK7872 .T55 H36 2002 EB | 1190066-1001 | Elsevier E-Book Collections | Searching... |
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