Select an Action
More-than-Moore 2.5D and 3D SiP Integration
Title:
More-than-Moore 2.5D and 3D SiP Integration
Author:
Radojcic, Riko. author.
ISBN:
9783319525488
Personal Author:
Physical Description:
XV, 182 p. 68 illus., 66 illus. in color. online resource.
Contents:
Introduction -- More-than-Moore Technology Opportunities: 2.5D SiP -- More-than-Moore Technology Opportunities: 3D SiP -- More-than-Moore Design Eco-System -- More-than-Moore Adoption Landscape.
Abstract:
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product. .
Added Corporate Author:
Electronic Access:
http://dx.doi.org/10.1007/978-3-319-52548-8Available:*
Shelf Number | Item Barcode | Shelf Location | Status |
|---|---|---|---|
| TK7888.4 | 481053-1001 | SPRINGER | Searching... |
On Order
Select a list
Make this your default list.
The following items were successfully added.
There was an error while adding the following items. Please try again.
:
Select An Item
Data usage warning: You will receive one text message for each title you selected.
Standard text messaging rates apply.