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      Cover image for CMOS past, present and future
      49. 
      CMOS past, present and future
      by 
      Radamson, Henry H., author.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Luminescence thermometry : methods, materials, and applications
      50. 
      Luminescence thermometry : methods, materials, and applications
      by 
      Dramićanin, M. (Miroslav), author.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Waste electrical and electronic equipment recycling : aqueous recovery methods
      51. 
      Waste electrical and electronic equipment recycling : aqueous recovery methods
      by 
      Vegliò, Francesco, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Wide bandgap power semiconductor packaging : materials, components, and reliability
      52. 
      Wide bandgap power semiconductor packaging : materials, components, and reliability
      by 
      Suganuma, Katsuaki, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for High mobility materials for CMOS applications
      53. 
      High mobility materials for CMOS applications
      by 
      Collaert, Nadine, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Optical thin films and coatings : from materials to applications
      54. 
      Optical thin films and coatings : from materials to applications
      by 
      Piegari, Angela, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Power electronics device applications of diamond semiconductors
      55. 
      Power electronics device applications of diamond semiconductors
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Nanostructured semiconductors
      56. 
      Nanostructured semiconductors
      by 
      Zhuiykov, Serge, author.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Polymer optical fibres : fibre types, materials, fabrication, characterisation and applications
      57. 
      Polymer optical fibres : fibre types, materials, fabrication, characterisation and applications
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      Excerpt: 
      Woodhead Publishing Series in Electronic and Optical Materials ;
      Cover image for Wireless MEMS networks and applications
      58. 
      Wireless MEMS networks and applications
      by 
      Uttamchandani, Deepak, editor.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials ;
      Cover image for Laser additive manufacturing : materials, design, technologies, and applications
      59. 
      Laser additive manufacturing : materials, design, technologies, and applications
      by 
      Brandt, Milan, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials ;
      Cover image for Optical interconnects for data centers
      60. 
      Optical interconnects for data centers
      by 
      Tekin, Tolga, editor.
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      Woodhead Publishing Series in Electronic and Optical Materials ;
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