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      Cover image for ISTFA '96 proceedings of the 22nd International Symposium for Testing and Failure Analysis : 18-22 November 1996, Los Angeles, California.
      145. 
      ISTFA '96 proceedings of the 22nd International Symposium for Testing and Failure Analysis : 18-22 November 1996, Los Angeles, California.
      by 
      International Symposium for Testing and Failure Analysis (22nd : 1996 : Los Angeles, Calif.)
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      Format: 
      Excerpt: 
      ASM International. Electronic Materials and Processing Division.
      Cover image for Characterization of integrated circuit packaging materials
      146. 
      Characterization of integrated circuit packaging materials
      by 
      Moore, Thomas M.
      ScienceDirect http://www.sciencedirect.com/science/book/9780750692670
      Format: 
      Excerpt: 
      Electronic packaging -- Materials.
      Cover image for The physics of carbon nanotube devices
      147. 
      The physics of carbon nanotube devices
      by 
      Léonard, François, 1972-
      ScienceDirect https://www.sciencedirect.com/science/book/9780815515739
      Format: 
      Excerpt: 
      Electronic apparatus and appliances -- Materials.
      Cover image for Polymers for electricity and electronics materials, properties, and applications
      148. 
      Polymers for electricity and electronics materials, properties, and applications
      by 
      Drobny, Jiri George.
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      Format: 
      Excerpt: 
      Electronic apparatus and appliances -- Materials.
      Cover image for Gaseous electronics tables, atoms, and molecules
      149. 
      Gaseous electronics tables, atoms, and molecules
      by 
      Raju, Gorur G., 1937-
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      Format: 
      Excerpt: 
      Electronic apparatus and appliances -- Materials.
      Cover image for Electroceramics VI : selected, peer reviewed papers from the 6th international conference on electroceramics (ICHSM 2010), November 9-13, 2013, Joâo Pessoa, Brazil
      150. 
      Cover image for Microelectronic circuit design
      151. 
      Microelectronic circuit design
      by 
      Jaeger, Richard C.
      Format: 
      Excerpt: 
      Electronic circuit design -- Audio visual materials -- CD-ROM's.
      Cover image for Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools
      152. 
      Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
      153. 
      Modern Aspects of Josephson Dynamics and Superconductivity Electronics
      by 
      Askerzade, Iman. author.
      http://dx.doi.org/10.1007/978-3-319-48433-4
      Format: 
      Excerpt: 
      Optical and Electronic Materials.
      Cover image for Active Metamaterials Terahertz Modulators and Detectors
      154. 
      Active Metamaterials Terahertz Modulators and Detectors
      by 
      Rout, Saroj. author.
      http://dx.doi.org/10.1007/978-3-319-52219-7
      Format: 
      Excerpt: 
      Optical and Electronic Materials.
      Cover image for Nonlinear Optics Principles and Applications
      155. 
      Nonlinear Optics Principles and Applications
      by 
      Li, Chunfei. author.
      http://dx.doi.org/10.1007/978-981-10-1488-8
      Format: 
      Excerpt: 
      Optical and Electronic Materials.
      Cover image for Plasmonic Organic Solar Cells Charge Generation and Recombination
      156. 
      Plasmonic Organic Solar Cells Charge Generation and Recombination
      by 
      Wu, Bo. author.
      http://dx.doi.org/10.1007/978-981-10-2021-6
      Format: 
      Excerpt: 
      Optical and Electronic Materials.
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