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      Cover image for Dielectric metamaterials : fundamentals, designs and applications
      37. 
      Dielectric metamaterials : fundamentals, designs and applications
      by 
      Brener, Igal, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Modeling, analysis, design, and tests for electronics packaging beyond Moore
      38. 
      Modeling, analysis, design, and tests for electronics packaging beyond Moore
      by 
      Zhang, Hengyun, author.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Ferroelectricity in doped hafnium oxide : materials, properties and devices
      39. 
      Ferroelectricity in doped hafnium oxide : materials, properties and devices
      by 
      Schroeder, Uwe, editor.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Industry standard FDSOI compact model BSIM-IMG for IC design
      40. 
      Industry standard FDSOI compact model BSIM-IMG for IC design
      by 
      Hu, Chenming, editor.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Advances in non-volatile memory and storage technology
      41. 
      Advances in non-volatile memory and storage technology
      by 
      Magyari-Köpe, Blanka, 1973- editor.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Fundamentals and sensing applications of 2D materials
      42. 
      Fundamentals and sensing applications of 2D materials
      by 
      Morgan, Hywel, 1960- editor.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Bioelectronics and medical devices : from materials to devices - fabrication, applications and reliability
      43. 
      Bioelectronics and medical devices : from materials to devices - fabrication, applications and reliability
      by 
      Pal, Kunal, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Waste electrical and electronic equipment (WEEE) handbook
      44. 
      Waste electrical and electronic equipment (WEEE) handbook
      by 
      Goodship, Vannessa, editor.
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      Woodhead Publishing series in electronic and optical materials.
      Cover image for Optical thin films and coatings : from materials to applications
      45. 
      Optical thin films and coatings : from materials to applications
      by 
      Piegari, Angela, editor.
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Power electronics device applications of diamond semiconductors
      46. 
      Power electronics device applications of diamond semiconductors
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      Format: 
      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Nanostructured semiconductors
      47. 
      Nanostructured semiconductors
      by 
      Zhuiykov, Serge, author.
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      Excerpt: 
      Woodhead Publishing series in electronic and optical materials.
      Cover image for Smart sensors and MEMS : intelligent devices and microsystems for industrial applications
      48. 
      Smart sensors and MEMS : intelligent devices and microsystems for industrial applications
      by 
      Nihtianov, Stoyan, editor.
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      Woodhead Publishing series in electronic and optical materials.
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