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      Cover image for New carbons : control of structure and functions
      265. 
      New carbons : control of structure and functions
      by 
      Inagaki, Michio.
      ScienceDirect http://www.sciencedirect.com/science/book/9780080437132
      Format: 
      Excerpt: 
      , microelectronics, aerospace and high temperature, etc. These newly developed carbon materials were called NEW
      Cover image for Micro mechanical systems : principles and technology
      266. 
      Micro mechanical systems : principles and technology
      by 
      Fukuda, T. (Toshio), 1948-
      ScienceDirect http://www.sciencedirect.com/science/book/9780444823632
      ScienceDirect http://www.sciencedirect.com/science/publication?issn=13862766&volume=6
      ScienceDirect http://www.sciencedirect.com/science/handbooks/13862766/6
      Format: 
      Excerpt: 
      . Section one is a general introduction to the historical background and the parallels to microelectronics
      Cover image for Neurobionics : an interdisciplinary approach to substitute impaired functions of the human nervous system
      267. 
      Neurobionics : an interdisciplinary approach to substitute impaired functions of the human nervous system
      by 
      Bothe, Hans-Werner.
      ScienceDirect http://www.sciencedirect.com/science/book/9780444899583
      Format: 
      Excerpt: 
      , neurophysiology), technical engineering (microelectronics, micromechanics, robotics, microsystems), and clinical
      Cover image for Reliability, maintainability, and risk : practical methods for engineers
      268. 
      Reliability, maintainability, and risk : practical methods for engineers
      by 
      Smith, David J. (David John), 1943 June 22-
      ScienceDirect http://www.sciencedirect.com/science/book/9780750608541
      Format: 
      Excerpt: 
      ""; ""4.2 Microelectronics data""; ""4.3 Overall data""
      Cover image for Biosensors
      269. 
      Cover image for Plasma deposition, treatment, and etching of polymers
      270. 
      Plasma deposition, treatment, and etching of polymers
      by 
      D'Agostino, Riccardo.
      ScienceDirect http://www.sciencedirect.com/science/book/9780122004308
      Format: 
      Excerpt: 
      to a broad range of industries from microelectronics to space technology * Discusses a wide array of
      Cover image for Computers and languages : theory and practice
      271. 
      Computers and languages : theory and practice
      by 
      Nijholt, Anton, 1946-
      ScienceDirect https://www.sciencedirect.com/science/book/9780444704634
      ScienceDirect https://www.sciencedirect.com/science/bookseries/09243542/4
      Format: 
      Excerpt: 
      Micro-Electronics; 5.3 Computers And Missiles; 5.4 Command, Control, And Communications; 5.5 Literature
      Cover image for Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders
      272. 
      Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders
      by 
      Reeve, Thomas C., author.
      http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10808283
      Format: 
      Excerpt: 
      , particularly for the small sample volumes that are relevant to microelectronics applications. Thus, my research
      Cover image for Study of Copper-Rich Intermetallic Phase Formation in Copper-Aluminum Binary System
      273. 
      Study of Copper-Rich Intermetallic Phase Formation in Copper-Aluminum Binary System
      by 
      Ouvarov-Bancalero, Valery Georges, author.
      http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10903176
      Format: 
      Excerpt: 
      available. More recently, the microelectronics industry started implementing the Cu wire-bond technology
      Cover image for Advances in Electrical Energy Storage Using Core-shell Structures and Relaxor-ferroelectric Materials
      274. 
      Cover image for Development of Trust Metrics for Quantifying Design Integrity and Error Implementation Cost
      275. 
      Development of Trust Metrics for Quantifying Design Integrity and Error Implementation Cost
      by 
      Kimura, Adam G., author.
      http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10871330
      Format: 
      Excerpt: 
      Vulnerability & Attack Mitigation are the major sub-fields of Trusted Microelectronics where research progress
      Cover image for The physics of microdroplets
      276. 
      The physics of microdroplets
      by 
      Berthier, Jean, 1952-
      Click to View
      Format: 
      Excerpt: 
      Conclusion 336 -- 10.7 References 337 -- 11. Capillary Self-assembly for 3D Microelectronics 341 -- 11.1
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