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Cover image for Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools

1.

Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools

by

Suzuki, Junichi. editor.

http://dx.doi.org/10.1007/978-3-319-50688-3

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Plasmonic Organic Solar Cells Charge Generation and Recombination

2.

Plasmonic Organic Solar Cells Charge Generation and Recombination

by

Wu, Bo. author.

http://dx.doi.org/10.1007/978-981-10-2021-6

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Materials for Advanced Packaging

3.

Materials for Advanced Packaging

by

Lu, Daniel. editor.

http://dx.doi.org/10.1007/978-3-319-45098-8

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for 3D Microelectronic Packaging From Fundamentals to Applications

4.

3D Microelectronic Packaging From Fundamentals to Applications

by

Li, Yan. editor.

http://dx.doi.org/10.1007/978-3-319-44586-1

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Piezoelectric MEMS Resonators

5.

Piezoelectric MEMS Resonators

by

Bhugra, Harmeet. editor.

http://dx.doi.org/10.1007/978-3-319-28688-4

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Frontiers in Electronic Technologies Trends and Challenges

6.

Frontiers in Electronic Technologies Trends and Challenges

by

Prabaharan, S.R.S. editor.

http://dx.doi.org/10.1007/978-981-10-4235-5

Format:

Excerpt:

Conference on NextGen Electronic Technologies (ICNETS2-2016). ICNETS2 encompasses six symposia covering all

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