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by
Wood, Neal Graham, author.
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Silicon carbide junction field effect transistor integrated circuits for hostile environments /
by
Tang, Qianying, author.
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Design and Characterization Techniques for Reliable and Secure Integrated Circuits / Tang, Qianying
by
Rengstl, Ulrich, author.
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Iii-v semiconductor photonic integrated circuits with quantum dots as single-photon emitters /
by
Zhao, Xueqian, author.
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Fast Very-large-scale Integrated (VLSI) Circuits Simulations / Zhao, Xueqian, author.
by
Martwick, Andrew Wayne, author.
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data transfer between integrated circuits. Clock jitter is a noise source in a communication link
by
Bai, Siqi, author.
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circuits. A novel modeling mothed, i.e. the plane pair PEEC method is proposed in this thesis to model the
by
Cakir, Burcin, author.
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Outsourcing of design and manufacturing processes makes integrated circuits (ICs) vulnerable to
by
Dave, Abhilasha Harsukhbhai, author.
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operations of the circuit. To simulate the circuits for the structural testing several Electronic Design
by
Gentry, Cale Michael, author.
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Chip-scale integrated photonic circuits provide an attractive platform for the implementation of
by
Wong, Chien-Heng, author.
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introduces a fully integrated CMOS dual source adaptive thermoelectric and RF energy harvesting circuit with
by
Krishna Prasad, Aditi, author.
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-level behavior of integrated circuits. As a result, there is a need for contemporary circuit simulation tools
by
Umapathy, Shylesh, author.
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high-speed, low-power integrated circuits. In modern semiconductor manufacturing, leakage power in high
by
Wang, Isaac Caleb, author.
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driving circuits have prompted research into other semiconducting materials. As a result, metal oxides
by
Fatima, Fnu, author.
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-assembly. It is needed to discover functional means to create components for integrated circuits as well as
by
Viera de Melo, Ana Cristina, author.
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advances in technologies for manufacturing integrated circuits. Also, the widely spread application of
by
Jackson, David L., author.
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particular test requirements of MDCML designs and DV arrays. The physical failure modes of bipolar circuits
by
Prakash, Abhijith, author.
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In the past, failure to handle heat dissipation in the integrated circuits (ICs) employing bipolar
by
Takhti, Mohammad, author.
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In the second part, two different application-specific integrated circuits (ASICs) for the front
by
Ng, Jimmy, author.
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electrostatic discharge protection tosemiconductor integrated circuits, establishing proof of concept via
by
Aljafar, Muayad Jaafar, author.
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dissipation in integrated circuits. Additionally, approaching the physical limit of semiconductor devices in
by
Dou, Wei, author.
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monolithically integrated into well-established and high-yield Si integrated circuits, which is favorable for
by
Brito, Nuno Andre Mano, author.
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opposite to what occurred in the Integrated Circuits (IC) industry. Also, new studies have sprung over the
by
Koyily, Anoop, author.
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. Typically, they are used for identifying and authenticating integrated circuits (ICs). In this work, we are
by
Sengupta, Deepashree, author.
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) circuits. Today's integrated circuits, which implement digital systems with billions of transistors in
by
Liu, Dong, author.
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electrical connection between integrated circuits and external leads. A solid free air ball (FAB), which is
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