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      Cover image for Materials science in microelectronics
      1. 
      Materials science in microelectronics
      by 
      Machlin, E. S.
      ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
      ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
      Format: 
      Excerpt: 
      Materials science in microelectronics / Machlin, E. S.
      Cover image for Materials science in microelectronics
      2. 
      Materials science in microelectronics
      by 
      Machlin, E. S.
      ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
      ScienceDirect http://www.sciencedirect.com/science/book/9780080446400
      Format: 
      Excerpt: 
      Materials science in microelectronics / Machlin, E. S.
      Cover image for System-level design with Rosetta
      3. 
      System-level design with Rosetta
      by 
      Alexander, Perry.
      Click to View
      Format: 
      Excerpt: 
      Microelectronics.
      Cover image for Digital design and computer architecture
      4. 
      Digital design and computer architecture
      by 
      Harris, David Money.
      ScienceDirect https://www.sciencedirect.com/science/book/9780123704979
      Format: 
      Excerpt: 
      TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
      Cover image for Ion exchange materials : properties and applications
      5. 
      Ion exchange materials : properties and applications
      by 
      Zagorodni, Andrei A.
      ScienceDirect http://www.sciencedirect.com/science/book/9780080445526
      Format: 
      Excerpt: 
      , medicine, microelectronics, the nuclear industry, food production, waste treatment, and many other areas
      Cover image for Nanoparticle technology handbook
      6. 
      Nanoparticle technology handbook
      by 
      Hosokawa, Masuo.
      ScienceDirect http://www.sciencedirect.com/science/book/9780444531223
      Format: 
      Excerpt: 
      localized surface plasmon resonance in metallic nanoparticles -- Chapter 4. Microelectronics packaging by