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Publication Date: 2018

Author

(2)

Alhamadani, Yasir, author.

(1)

Aljafar, Muayad Jaafar, author.

(1)

Brown, James Emery, author.

(1)

Cornell University. Chemical Engineering. degree granting institution.

(1)

Gentry, Cale Michael, author.

(1)

Kansas State University. Department of Chemistry. degree granting institution.

(1)

Karak, Niranjan.

(1)

Kohli, Rajiv, 1947-

(1)

Korotcenkov, Ghenadii.

(1)

Li, Wenming, author.

(1)

Li, Yuk Mun, author. (orcid)0000-0002-9382-8055

(1)

Mastro, Michael.

(1)

Mittal, K. L., 1945-

(1)

North Carolina Agricultural and Technical State University. Nanoengineering. degree granting institution.

(1)

Ouvarov-Bancalero, Valery Georges, author.

(1)

Pearton, Stephen.

(1)

Portland State University. Electrical and Computer Engineering. degree granting institution.

(1)

Purdue University. Materials Engineering. degree granting institution.

(1)

Razgaleh, Sara, author.

(1)

Reeve, Thomas C., author.

(1)

(1)

The University of Texas at Arlington. Materials Science and Engineering. degree granting institution.

(1)

Torres, Daniela Alejandra, author.

(1)

Tufts University. Mechanical Engineering. degree granting institution.

(1)

University of Colorado at Boulder. Electrical Engineering. degree granting institution.

(1)

University of South Carolina. Civil Engineering. degree granting institution.

(1)

University of South Carolina. Mechanical Engineering. degree granting institution.

(1)

Özerdem, Mehmet Siraç

(1)

Material Type

Language

(15)

(1)

Subject

(5)

Electronic books.

(5)

Materials science.

(5)

(3)

(3)

(2)

Mechanical engineering.

(2)

Microelectronics.

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Analytical chemistry.

(1)

Chemical engineering.

(1)

(1)

(1)

(1)

Electrical and electronics

(1)

Electrical engineering.

(1)

Elektrik-elektronik

(1)

(1)

Environmental engineering.

(1)

Gallium compounds..

(1)

Mühendislik bilimleri

(1)

Nanocomposites (Materials).

(1)

(1)

Nanostructured materials..

(1)

(1)

(1)

(1)

Particles -- Measurement.

(1)

Surface contamination -- Prevention.

(1)

Surfaces (Technology) -- Inspection.

(1)

(1)

Library

Başkent Library

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Cover image for Materials science in microelectronics

Materials science in microelectronics

1.

Materials science in microelectronics

by

Machlin, E. S.

ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400

Format:

Excerpt:

Materials science in microelectronics / Machlin, E. S.

Cover image for Materials science in microelectronics

Materials science in microelectronics

2.

Materials science in microelectronics

by

Machlin, E. S.

ScienceDirect http://www.sciencedirect.com/science/book/9780080446394
ScienceDirect http://www.sciencedirect.com/science/book/9780080446400

Format:

Excerpt:

Materials science in microelectronics / Machlin, E. S.

Cover image for Mikroelektroniğin Temelleri

Mikroelektroniğin Temelleri

3.

Mikroelektroniğin Temelleri

by

Özerdem, Mehmet Siraç

https://www.turcademy.com/tr/kitap/mikroelektronigin-temelleri-9786053558736

Format:

Excerpt:

olarak önerilmektedir ve Behzad Razavi’nin “Fundamentals of Microelectronics” kitabının 2. baskısından

Cover image for Scalable Quantum Light Sources in Silicon Photonic Circuits

Scalable Quantum Light Sources in Silicon Photonic Circuits

4.

Scalable Quantum Light Sources in Silicon Photonic Circuits

by

Gentry, Cale Michael, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10791965

Format:

Excerpt:

microelectronics industry. Integration of these quantum photonic sources with high-performance classical photonic

Cover image for An In-Situ Microcoaxial Fabrication and Attachment Strategy

An In-Situ Microcoaxial Fabrication and Attachment Strategy

5.

An In-Situ Microcoaxial Fabrication and Attachment Strategy

by

Torres, Daniela Alejandra, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10812322

Format:

Excerpt:

microelectronics packaging platform that will reduce the time required to design and fabricate complex multi

Cover image for Developments in surface contamination and cleaning

Developments in surface contamination and cleaning

6.

Developments in surface contamination and cleaning

by

Kohli, Rajiv, 1947-

ScienceDirect http://www.sciencedirect.com/science/book/9781437778304

Format:

Excerpt:

and quality control, and procurement specifications across sectors including microelectronics

Cover image for Triblock Terpolymer Derived Isoporous Ultrafiltration Membranes

Triblock Terpolymer Derived Isoporous Ultrafiltration Membranes

7.

Triblock Terpolymer Derived Isoporous Ultrafiltration Membranes

by

Li, Yuk Mun, author. (orcid)0000-0002-9382-8055

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10748310

Format:

Excerpt:

nanotechnological applications ranging from the microelectronics industry all the way to separation. A particularly

Cover image for Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental and Health Effects

Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental and Health Effects

8.

Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental and Health Effects

by

Razgaleh, Sara, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10786870

Format:

Excerpt:

environment uniquely. Current challenges in microelectronics industry may be addressed using nanoparticles due

Cover image for New Approaches for Memristive Logic Computations

New Approaches for Memristive Logic Computations

9.

New Approaches for Memristive Logic Computations

by

Aljafar, Muayad Jaafar, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10825749

Format:

Excerpt:

Over the past five decades, exponential advances in device integration in microelectronics for

Cover image for Evaluation of Sonocatalytic Degradation of Ibuprofen and Sulfamethoxazole in the Presence of Various Catalysts

Evaluation of Sonocatalytic Degradation of Ibuprofen and Sulfamethoxazole in the Presence of Various Catalysts

10.

Evaluation of Sonocatalytic Degradation of Ibuprofen and Sulfamethoxazole in the Presence of Various Catalysts

by

Alhamadani, Yasir, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10748128

Format:

Excerpt:

, sensors, energy storage, microelectronics, biomedicines, and mechanical resonators. However, a key

Cover image for Enhance Flow Boiling in Microchannels by Regulating Two-Phase Transport Patterns

Enhance Flow Boiling in Microchannels by Regulating Two-Phase Transport Patterns

11.

Enhance Flow Boiling in Microchannels by Regulating Two-Phase Transport Patterns

by

Li, Wenming, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10750487

Format:

Excerpt:

Flow boiling in microchannels is one of the most promising cooling techniques for microelectronics

Cover image for Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders

Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders

12.

Nucleation, Growth, and Structure of Beta-Tin in Tin-Based Lead-Free Solders

by

Reeve, Thomas C., author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10808283

Format:

Excerpt:

, particularly for the small sample volumes that are relevant to microelectronics applications. Thus, my research

Cover image for Study of Copper-Rich Intermetallic Phase Formation in Copper-Aluminum Binary System

Study of Copper-Rich Intermetallic Phase Formation in Copper-Aluminum Binary System

13.

Study of Copper-Rich Intermetallic Phase Formation in Copper-Aluminum Binary System

by

Ouvarov-Bancalero, Valery Georges, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10903176

Format:

Excerpt:

available. More recently, the microelectronics industry started implementing the Cu wire-bond technology

Cover image for Advances in Electrical Energy Storage Using Core-shell Structures and Relaxor-ferroelectric Materials

Advances in Electrical Energy Storage Using Core-shell Structures and Relaxor-ferroelectric Materials

14.

Advances in Electrical Energy Storage Using Core-shell Structures and Relaxor-ferroelectric Materials

by

Brown, James Emery, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10791765

Format:

Excerpt:

cars, microelectronics, portable electronics and grid storage backup for renewable energy utilization

Cover image for Gallium Oxide : Technology, Devices and Applications.

Gallium Oxide : Technology, Devices and Applications.

15.

Gallium Oxide : Technology, Devices and Applications.

by

Pearton, Stephen.

Format:

Excerpt:

microelectronics -- 10.5 Research opportunities for Ohmic contacts to Ga2O3 -- Acknowledgment -- References

Cover image for Nanomaterials and Polymer Nanocomposites : Raw Materials to Applications.

Nanomaterials and Polymer Nanocomposites : Raw Materials to Applications.

16.

Nanomaterials and Polymer Nanocomposites : Raw Materials to Applications.

by

Karak, Niranjan.

Format:

Excerpt:

Properties -- 5.6. Advanced Applications of CNT/Polymer Nanocomposites -- 5.6.1. Advanced Microelectronics

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