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2017
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      Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
      1. 
      Outlook and Challenges of Nano Devices, Sensors, and MEMS
      by 
      Li, Ting. editor.
      http://dx.doi.org/10.1007/978-3-319-50824-5
      Format: 
      Excerpt: 
      designed via models and simulations, how to improve reliability, and what are the possible challenges and
      Cover image for SiGe-based Re-engineering of Electronic Warfare Subsystems
      2. 
      SiGe-based Re-engineering of Electronic Warfare Subsystems
      by 
      Lambrechts, Wynand. author.
      http://dx.doi.org/10.1007/978-3-319-47403-8
      Format: 
      Excerpt: 
      that focuses especially on the speed and reliability of current-generation SiGe circuits and highlights
      Cover image for Nanometer CMOS ICs From Basics to ASICs
      3. 
      Nanometer CMOS ICs From Basics to ASICs
      by 
      J.M. Veendrick, Harry. author.
      http://dx.doi.org/10.1007/978-3-319-47597-4
      Format: 
      Excerpt: 
      Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug
      Cover image for Carbon Nanotubes for Interconnects Process, Design and Applications
      4. 
      Carbon Nanotubes for Interconnects Process, Design and Applications
      by 
      Todri-Sanial, Aida. editor.
      http://dx.doi.org/10.1007/978-3-319-29746-0
      Format: 
      Excerpt: 
      improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be
      Cover image for The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era
      5. 
      The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era
      by 
      Rahmani, Amir M. editor.
      http://dx.doi.org/10.1007/978-3-319-31596-6
      Format: 
      Excerpt: 
      -efficient, dedicated solutions and technologies to maximize the utilization and reliability of microprocessors. Enables
      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      6. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      .-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures