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Advances in Reliability and System Engineering

Ram, Mangey. editor.

http://dx.doi.org/10.1007/978-3-319-48875-2

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Advances in Reliability and System Engineering Ram, Mangey. editor.

Fundamentals of Electronic Systems Design

Lienig, Jens. author.

http://dx.doi.org/10.1007/978-3-319-55840-0

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Requirements -- Reliability Analysis -- Thermal Management and Cooling -- Electromagnetic Compatibility (EMC

Outlook and Challenges of Nano Devices, Sensors, and MEMS

Li, Ting. editor.

http://dx.doi.org/10.1007/978-3-319-50824-5

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designed via models and simulations, how to improve reliability, and what are the possible challenges and

SiGe-based Re-engineering of Electronic Warfare Subsystems

Lambrechts, Wynand. author.

http://dx.doi.org/10.1007/978-3-319-47403-8

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that focuses especially on the speed and reliability of current-generation SiGe circuits and highlights

Nanometer CMOS ICs From Basics to ASICs

J.M. Veendrick, Harry. author.

http://dx.doi.org/10.1007/978-3-319-47597-4

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Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug

Carbon Nanotubes for Interconnects Process, Design and Applications

Todri-Sanial, Aida. editor.

http://dx.doi.org/10.1007/978-3-319-29746-0

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improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be

The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era

Rahmani, Amir M. editor.

http://dx.doi.org/10.1007/978-3-319-31596-6

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-efficient, dedicated solutions and technologies to maximize the utilization and reliability of microprocessors. Enables

Hardware Security and Trust Design and Deployment of Integrated Circuits in a Threatened Environment

Sklavos, Nicolas. editor.

http://dx.doi.org/10.1007/978-3-319-44318-8

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, manufacturing, testing, reliability, validation and utilization; Describes new methods and algorithms for the

3D Microelectronic Packaging From Fundamentals to Applications

Li, Yan. editor.

http://dx.doi.org/10.1007/978-3-319-44586-1

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.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures

10.

Materials for Advanced Packaging

Lu, Daniel. editor.

http://dx.doi.org/10.1007/978-3-319-45098-8

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Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New

11.

Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems

Nath, Vijay. editor.

http://dx.doi.org/10.1007/978-981-10-2999-8

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in Images -- 22. Reliability and Energy Benefit Analysis of Distribution System incorporating Wind

12.

Components and Services for IoT Platforms Paving the Way for IoT Standards

Keramidas, Georgios. editor.

http://dx.doi.org/10.1007/978-3-319-42304-3

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-related requirements such as low-power, time-to-market, connectivity, reliability, interoperability, security, and

13.

Electronic circuits, systems, and standards : the best of EDN

Hickman, Ian.

ScienceDirect http://www.sciencedirect.com/science/book/9780750600682

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reliability; and amplitude-locked loop speeds filter test. The text will be useful to student.

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