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      Cover image for Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
      1. 
      Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
      by 
      Bailey, Christopher.
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      Format: 
      Excerpt: 
      Advanced manufacturing process, lead free interconnect materials and reliability modeling for
      Cover image for Adhesives technology for electronic applications : materials, processes, reliability
      2. 
      Adhesives technology for electronic applications : materials, processes, reliability
      by 
      Licari, James J., 1930-
      ScienceDirect http://www.sciencedirect.com/science/book/9780815515135
      Format: 
      Excerpt: 
      Adhesives technology for electronic applications : materials, processes, reliability / Licari
      Cover image for LED packaging for lighting applications design, manufacturing, and testing
      3. 
      LED packaging for lighting applications design, manufacturing, and testing
      by 
      Liu, S. (Sheng), 1963-
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      Format: 
      Excerpt: 
      "This book provides quantitative methods for optical, thermal, reliability modelling and simulation
      Cover image for Hermeticity of electronic packages
      4. 
      Hermeticity of electronic packages
      by 
      Greenhouse, Hal.
      ScienceDirect http://www.sciencedirect.com/science/book/9780815514350
      Format: 
      Excerpt: 
      , reliability engineers, and those who measure and evaluate the integrity of packages to apply this knowledge to
      Cover image for Hermeticity of electronic packages
      5. 
      Hermeticity of electronic packages
      by 
      Greenhouse, Hal.
      ScienceDirect An electronic book accessible through the World Wide Web; click for information
      Format: 
      Excerpt: 
      penetrating the seal or an opening (crack) in the package̮especially critical to the reliability and longevity
      Cover image for Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
      6. 
      Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
      by 
      Lee, Ning-Cheng.
      ScienceDirect http://www.sciencedirect.com/science/book/9780750672184
      ScienceDirect https://www.sciencedirect.com/science/book/9780750672184
      Format: 
      Excerpt: 
      technique, assembly, and rework process, --and provides an increased understanding of the reliability