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2002
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      Cover image for Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
      1. 
      Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
      by 
      Lee, Ning-Cheng.
      ScienceDirect http://www.sciencedirect.com/science/book/9780750672184
      ScienceDirect https://www.sciencedirect.com/science/book/9780750672184
      Format: 
      Excerpt: 
      Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or