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Subject: Mechanical engineering.

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Purdue University. Mechanical Engineering. degree granting institution.

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Alrefae, Majed A., author.

(1)

Bair, Michael O., author.

(1)

Davim, J. Paulo. author.

(1)

Di, Yuan, author.

(1)

Dixit, Uday Shanker. author.

(1)

Drummond, Kevin P., author.

(1)

Gasbarri, Federico, author.

(1)

Hau, William, author.

(1)

Hayes, Austin, author.

(1)

Hazarika, Manjuri. author.

(1)

Hong Kong University of Science and Technology (Hong Kong). degree granting institution.

(1)

Kankipati, J. V. M. S. Avinash, author.

(1)

Lamar University - Beaumont. Mechanical Engineering. degree granting institution.

(1)

Langford, Nathan Charles, author.

(1)

Li, Kan, author. (orcid)0000-0003-4864-3446

(1)

Mashhadi, Ardeshir Raihanian, author.

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Missouri University of Science and Technology. Mechanical Engineering. degree granting institution.

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Northern Arizona University. Mechanical Engineering. degree granting institution.

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Northwestern University. Theoretical and Applied Mechanics. degree granting institution.

(1)

Oklahoma State University. Mechanical & Aerospace Engineering. degree granting institution.

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Pandian, Guru Prasad, author. (orcid)0000-0002-4291-4535

(1)

Ren, Yao, author.

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Rochester Institute of Technology. Mechanical Engineering. degree granting institution.

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Sabbaghi, Mostafa, author. (orcid)0000-0002-9961-5691

(1)

Shi, Xinyu, author.

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Smith, Edward H. (Mechanical engineer)

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SpringerLink (Online service)

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State University of New York at Buffalo. Industrial Engineering. degree granting institution.

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State University of New York at Buffalo. Mechanical and Aerospace Engineering. degree granting institution.

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Sun, Qingyang, author. (orcid)0000-0003-1732-7854

(1)

Tufts University. Mechanical Engineering. degree granting institution.

(1)

University of Cincinnati. Engineering and Applied Science: Mechanical Engineering. degree granting institution.

(1)

University of Colorado at Boulder. Mechanical Engineering. degree granting institution.

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University of Maryland, College Park. Mechanical Engineering. degree granting institution.

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University of Massachusetts Lowell. degree granting institution.

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Cover image for Mechanical Design and Analysis of Three-Dimensional (3D) Assembly, with Applications on Wearable Electronics, Thermo-Electric Energy Harvester and Microflyer

Mechanical Design and Analysis of Three-Dimensional (3D) Assembly, with Applications on Wearable Electronics, Thermo-Electric Energy Harvester and Microflyer

1.

Mechanical Design and Analysis of Three-Dimensional (3D) Assembly, with Applications on Wearable Electronics, Thermo-Electric Energy Harvester and Microflyer

by

Li, Kan, author. (orcid)0000-0003-4864-3446

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:13427035

Format:

Excerpt:

Electronics, Thermo-Electric Energy Harvester and Microflyer / Li, Kan, author. (orcid)0000-0003-4864-3446

Cover image for Additively manufactured on-demand and conformal printed electronics building blocks that enable a completely 3D Printed Radio Frequency System

Additively manufactured on-demand and conformal printed electronics building blocks that enable a completely 3D Printed Radio Frequency System

2.

Additively manufactured on-demand and conformal printed electronics building blocks that enable a completely 3D Printed Radio Frequency System

by

Langford, Nathan Charles, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10836947

Format:

Excerpt:

Additively manufactured on-demand and conformal printed electronics building blocks that enable a

Cover image for Mechanical engineer's reference book.

Mechanical engineer's reference book.

3.

Mechanical engineer's reference book.

by

Smith, Edward H. (Mechanical engineer)

ScienceDirect http://www.sciencedirect.com/science/book/9780080523989

Format:

Excerpt:

Mechanical engineering principles -- Electrical and electronics principles -- Microprocessors

Cover image for Ultrasound Transducers for a Simplified Martian Acoustic Anemometer

Ultrasound Transducers for a Simplified Martian Acoustic Anemometer

4.

Ultrasound Transducers for a Simplified Martian Acoustic Anemometer

by

Shi, Xinyu, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10811953

Format:

Excerpt:

the control electronics, electromechanical coupling of the transducers and attenuation of sound, is

Cover image for A Brief History of Mechanical Engineering

A Brief History of Mechanical Engineering

5.

A Brief History of Mechanical Engineering

by

Dixit, Uday Shanker. author.

http://dx.doi.org/10.1007/978-3-319-42916-8

Format:

Excerpt:

of additive manufacturing start? When did the marriage of mechanical and electronics give birth to

Cover image for Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin)

Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin)

6.

Effect of Long-term Aging on Lead-free Solder (SAC405) and Surface Finish (Pure Tin)

by

Pandian, Guru Prasad, author. (orcid)0000-0002-4291-4535

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10686951

Format:

Excerpt:

-term reliability of lead-free electronics. Known issues of tin whiskers and solder interconnect fatigue which can

Cover image for The Wound-on-Tension of Winders with Nip Rollers

The Wound-on-Tension of Winders with Nip Rollers

7.

The Wound-on-Tension of Winders with Nip Rollers

by

Ren, Yao, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10247895

Format:

Excerpt:

such as plastic webs, metal foils, to the recent printed and flexible electronics. Winding or rewinding

Cover image for Multifunctional Wearable Epidermal Device for Physiological Signal Monitoring in Sleep Study

Multifunctional Wearable Epidermal Device for Physiological Signal Monitoring in Sleep Study

8.

Multifunctional Wearable Epidermal Device for Physiological Signal Monitoring in Sleep Study

by

Kankipati, J. V. M. S. Avinash, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10188220

Format:

Excerpt:

and flexible electronics to such a membrane provides an epidermal electronic system (EES) that can

Cover image for Enhanced System Health Assessment using Adaptive Self-Learning Techniques

Enhanced System Health Assessment using Adaptive Self-Learning Techniques

9.

Enhanced System Health Assessment using Adaptive Self-Learning Techniques

by

Di, Yuan, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10891689

Format:

Excerpt:

. For the power electronics modules monitoring case, the proposed approach also demonstrated its

Cover image for Bio-Inspired Robotics Based on Liquid Crystalline Elastomers(LCEs) and Flexible Stimulators

Bio-Inspired Robotics Based on Liquid Crystalline Elastomers(LCEs) and Flexible Stimulators

10.

Bio-Inspired Robotics Based on Liquid Crystalline Elastomers(LCEs) and Flexible Stimulators

by

Sun, Qingyang, author. (orcid)0000-0003-1732-7854

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10808926

Format:

Excerpt:

). Different from flexible electronics which are actually solid, "liquid electronics" suits more in the term

Cover image for Additive Manufactured Microstructures and Designs for High Heat Flux Dissipation During Pool Boiling

Additive Manufactured Microstructures and Designs for High Heat Flux Dissipation During Pool Boiling

11.

Additive Manufactured Microstructures and Designs for High Heat Flux Dissipation During Pool Boiling

by

Hayes, Austin, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10815089

Format:

Excerpt:

producing large heat fluxes. These industries include electronics and power generation. For electronics, as

Cover image for Characterization of Mechanical and Energy Absorption Properties of Additively-manufactured Mechanical Metamaterials

Characterization of Mechanical and Energy Absorption Properties of Additively-manufactured Mechanical Metamaterials

12.

Characterization of Mechanical and Energy Absorption Properties of Additively-manufactured Mechanical Metamaterials

by

Gasbarri, Federico, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10816139

Format:

Excerpt:

applications, e.g.: in the electronics, we need superfast chips that can dissipate heat and conduct electricity

Cover image for The Design and Testing of a Powered Exoskeleton to Reduce the Metabolic Cost of Walking in Individuals with Cerebral Palsy

The Design and Testing of a Powered Exoskeleton to Reduce the Metabolic Cost of Walking in Individuals with Cerebral Palsy

13.

The Design and Testing of a Powered Exoskeleton to Reduce the Metabolic Cost of Walking in Individuals with Cerebral Palsy

by

Bair, Michael O., author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10821623

Format:

Excerpt:

brushless DC motors, electronics to control actuation, and a power supply. Plantarflexion, or "push

Cover image for Fabrication of Organic Ferroelectric Memory by Friction-Transfer Method

Fabrication of Organic Ferroelectric Memory by Friction-Transfer Method

14.

Fabrication of Organic Ferroelectric Memory by Friction-Transfer Method

by

Hau, William, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10903335

Format:

Excerpt:

' compatibility with flexible electronics, an emerging technology. Moreover, the material and processing costs are

Cover image for Process Characterization and Optimization of Roll-to-roll Plasma Chemical Vapor Deposition for Graphene Growth

Process Characterization and Optimization of Roll-to-roll Plasma Chemical Vapor Deposition for Graphene Growth

15.

Process Characterization and Optimization of Roll-to-roll Plasma Chemical Vapor Deposition for Graphene Growth

by

Alrefae, Majed A., author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10793581

Format:

Excerpt:

electronics devices. (Abstract shortened by ProQuest.).

Cover image for Consumer Behavior Modeling in System Design for Ease-of-repair and Ease-of-return

Consumer Behavior Modeling in System Design for Ease-of-repair and Ease-of-return

16.

Consumer Behavior Modeling in System Design for Ease-of-repair and Ease-of-return

by

Sabbaghi, Mostafa, author. (orcid)0000-0002-9961-5691

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10817665

Format:

Excerpt:

and opportunities in the consumer electronics repair sector, and conceptualizing the design for ease

Cover image for Improving the Effectiveness of End-of-use Product Recovery: Operations Planning, Consumer Behavior and Design Guidelines

Improving the Effectiveness of End-of-use Product Recovery: Operations Planning, Consumer Behavior and Design Guidelines

17.

Improving the Effectiveness of End-of-use Product Recovery: Operations Planning, Consumer Behavior and Design Guidelines

by

Mashhadi, Ardeshir Raihanian, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10823857

Format:

Excerpt:

maintenance processes, our entire understanding of the repair practices done on consumer electronics comes

Cover image for Characterization of Manifold Microchannel Heat Sinks During Two-Phase Operation

Characterization of Manifold Microchannel Heat Sinks During Two-Phase Operation

18.

Characterization of Manifold Microchannel Heat Sinks During Two-Phase Operation

by

Drummond, Kevin P., author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10748638

Format:

Excerpt:

2100 kg/m 2s at a constant inlet temperature of 59 °C. To simulate heat generation from electronics

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