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      Cover image for Fracture at all Scales
      1. 
      Fracture at all Scales
      by 
      Pluvinage, Guy. editor.
      http://dx.doi.org/10.1007/978-3-319-32634-4
      Format: 
      Excerpt: 
      vessels and boilers) • safety and reliability of welded joints This book includes 12 contributions from
      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      2. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      .-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures
      Cover image for Materials for Advanced Packaging
      3. 
      Materials for Advanced Packaging
      by 
      Lu, Daniel. editor.
      http://dx.doi.org/10.1007/978-3-319-45098-8
      Format: 
      Excerpt: 
      Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New
      Cover image for Self-diffusion and impurity diffusion in pure metals : handbook of experimental data
      4. 
      Self-diffusion and impurity diffusion in pure metals : handbook of experimental data
      by 
      Neumann, G. (Gerhard), 1937-
      ScienceDirect https://www.sciencedirect.com/science/book/9781856175111
      ScienceDirect https://www.sciencedirect.com/science/bookseries/14701804/14
      Format: 
      Excerpt: 
      investigations) . Indication of reliability of the measurements . Reassessment of many early results . Data can