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      Cover image for Next Generation Spin Torque Memories
      1. 
      Next Generation Spin Torque Memories
      by 
      Kaushik, Brajesh Kumar. author.
      http://dx.doi.org/10.1007/978-981-10-2720-8
      Format: 
      Excerpt: 
      and discusses the outlook for this cutting-edge technology. It also describes the architectures
      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      2. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      analysis Discusses 3D electronic package architecture and assembly process design Features contributions