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      Cover image for The Investigation of Plastic Behavior by Discrete Dislocation Dynamics for Single Crystal Pillar at Submicron Scale
      1. 
      The Investigation of Plastic Behavior by Discrete Dislocation Dynamics for Single Crystal Pillar at Submicron Scale
      by 
      Cui, Yinan. author.
      http://dx.doi.org/10.1007/978-981-10-3032-1
      Format: 
      Excerpt: 
      presented in this thesis yield valuable new guidelines for microdevice design, reliability analysis and
      Cover image for Outlook and Challenges of Nano Devices, Sensors, and MEMS
      2. 
      Outlook and Challenges of Nano Devices, Sensors, and MEMS
      by 
      Li, Ting. editor.
      http://dx.doi.org/10.1007/978-3-319-50824-5
      Format: 
      Excerpt: 
      designed via models and simulations, how to improve reliability, and what are the possible challenges and
      Cover image for Springer Handbook of Nanotechnology
      3. 
      Springer Handbook of Nanotechnology
      by 
      Bhushan, Bharat. editor.
      http://dx.doi.org/10.1007/978-3-662-54357-3
      Format: 
      Excerpt: 
      reliability engineering knowledge in just one volume. Furthermore, it discusses various nanostructures; micro
      Cover image for Piezoelectric MEMS Resonators
      4. 
      Piezoelectric MEMS Resonators
      by 
      Bhugra, Harmeet. editor.
      http://dx.doi.org/10.1007/978-3-319-28688-4
      Format: 
      Excerpt: 
      Implementation of Piezoelectric MEMS Resonators -- Reliability and Quality Assessment (Stability and Packages
      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      5. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      .-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures
      Cover image for Materials for Advanced Packaging
      6. 
      Materials for Advanced Packaging
      by 
      Lu, Daniel. editor.
      http://dx.doi.org/10.1007/978-3-319-45098-8
      Format: 
      Excerpt: 
      Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New
      Cover image for Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems
      7. 
      Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems
      by 
      Nath, Vijay. editor.
      http://dx.doi.org/10.1007/978-981-10-2999-8
      Format: 
      Excerpt: 
      in Images -- 22. Reliability and Energy Benefit Analysis of Distribution System incorporating Wind
      Cover image for Scalable Micro and Nano Manufacturing of Photonic Devices
      8. 
      Scalable Micro and Nano Manufacturing of Photonic Devices
      by 
      Chen, Xiangfan, author. (orcid)0000-0002-5627-7530
      http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10792907
      Format: 
      Excerpt: 
      scalability, reliability, and cost-effectiveness. For example, three-dimensional (3D) printing technologies