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      by 
      Gentry, Cale Michael, author.
      Format: 
      Excerpt: 
      microelectronics industry. Integration of these quantum photonic sources with high-performance classical photonic
      by 
      Torres, Daniela Alejandra, author.
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      Excerpt: 
      microelectronics packaging platform that will reduce the time required to design and fabricate complex multi
      by 
      Leung, Wing Tong, author.
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      Excerpt: 
      processes. It is undesirable in many scenarios, e.g. contamination in the manufacturing of microelectronics
      by 
      Li, Yuk Mun, author. (orcid)0000-0002-9382-8055
      Format: 
      Excerpt: 
      nanotechnological applications ranging from the microelectronics industry all the way to separation. A particularly
      by 
      Aljafar, Muayad Jaafar, author.
      Format: 
      Excerpt: 
      Over the past five decades, exponential advances in device integration in microelectronics for
      by 
      Milakovich, Timothy John, author.
      Format: 
      Excerpt: 
      by the Si microelectronics industry has made the use of Si for microelectronics, power electronics
      by 
      Reeve, Thomas C., author.
      Format: 
      Excerpt: 
      , particularly for the small sample volumes that are relevant to microelectronics applications. Thus, my research
      by 
      Ouvarov-Bancalero, Valery Georges, author.
      Format: 
      Excerpt: 
      available. More recently, the microelectronics industry started implementing the Cu wire-bond technology