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University of Cincinnati. Engineering : Materials Science. degree granting institution.
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Nalwa, Hari Singh, 1954-
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Anderson, Wayne, edited
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Baláž, P. (Peter), 1947-
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      Cover image for Materials science and engineering
      1. 
      Materials science and engineering
      by 
      Callister, William D., Jr., 1940-
      Format: 
      Excerpt: 
      Materials science and engineering / Callister, William D., Jr., 1940-
      Cover image for Introduction to materials science for engineers
      2. 
      Introduction to materials science for engineers
      by 
      Shackelford, James F.
      Format: 
      Excerpt: 
      Introduction to materials science for engineers / Shackelford, James F.
      Cover image for Waste materials in construction : WASCON 2000 : proceedings of the International Conference on the Science and Engineering of Recycling for Environmental Protection, Harrogate, England, 31 May, 1-2 June 2000
      3. 
      Waste materials in construction : WASCON 2000 : proceedings of the International Conference on the Science and Engineering of Recycling for Environmental Protection, Harrogate, England, 31 May, 1-2 June 2000
      by 
      International Conference on the Science and Engineering of Recycling for Environmental Protection (2000 : Harrogate, England)
      ScienceDirect http://www.sciencedirect.com/science/book/9780080437903
      ScienceDirect http://www.sciencedirect.com/science/publication?issn=14787482&volume=1
      Format: 
      Excerpt: 
      Science and Engineering of Recycling for Environmental Protection, Harrogate, England, 31 May, 1-2 June
      Cover image for Experimental methods
      4. 
      Experimental methods
      by 
      Herman, Herbert.
      ScienceDirect http://www.sciencedirect.com/science/book/9780123418197
      ScienceDirect http://www.sciencedirect.com/science/book/9780123418425
      Format: 
      Excerpt: 
      Treatise on materials science and technology ;
      Cover image for Introduction to manufacturing processes
      5. 
      Introduction to manufacturing processes
      by 
      Schey, John A.
      Format: 
      Excerpt: 
      McGraw-Hill series in mechanical engineering and materials science
      Cover image for The actinides: electronic structure and related properties
      6. 
      The actinides: electronic structure and related properties
      by 
      Freeman, Arthur J.
      ScienceDirect http://www.sciencedirect.com/science/book/9780122667015
      ScienceDirect http://www.sciencedirect.com/science/book/9780122667022
      Format: 
      Excerpt: 
      Materials science and technology (New York, N.Y.)
      Cover image for Hermeticity of electronic packages
      7. 
      Hermeticity of electronic packages
      by 
      Greenhouse, Hal.
      ScienceDirect http://www.sciencedirect.com/science/book/9780815514350
      Format: 
      Excerpt: 
      Materials science and process technology series.
      Cover image for Wide bandgap semiconductors : growth, processing and applications
      8. 
      Cover image for Handbook of ceramic grinding and polishing
      9. 
      Handbook of ceramic grinding and polishing
      by 
      Marinescu, Ioan D.
      ScienceDirect http://www.sciencedirect.com/science/book/9780815514244
      Format: 
      Excerpt: 
      Materials science and process technology series. Ceramic and other materials--processing and
      Cover image for Measurement Of Residual Stresses in Diesel Components using X-ray, Synchrotron, and Neutron Diffraction
      10. 
      Cover image for Surface Modification of Micron-Size Powders by Plasma Polymerization
      11. 
      Cover image for Direct Deposition of c-Axis Textured High-T c YBCO Superconducting Thick Films on Unoriented Metallic Substrates
      12.