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      Cover image for Handbook of 3D integration. Volume 3, 3D process technology
      1. 
      Handbook of 3D integration. Volume 3, 3D process technology
      by 
      Garrou, Philip, editor.
      Click to View
      Format: 
      Excerpt: 
      Integrated circuits -- Design and construction.
      Cover image for Dealing with electronics
      2. 
      Dealing with electronics
      by 
      Drosg, Manfred, author.
      Click to View
      Format: 
      Excerpt: 
      Integrated circuits -- Textbooks.
      Cover image for Gallium arsenide IC applications handbook
      3. 
      Gallium arsenide IC applications handbook
      by 
      Fisher, Dennis G., Ph. D.
      ScienceDirect http://www.sciencedirect.com/science/book/9780122577352
      Format: 
      Excerpt: 
      Microwave integrated circuits.
      Cover image for Vertical 3D memory technologies
      4. 
      Vertical 3D memory technologies
      by 
      Prince, Betty, author.
      Click to View
      Format: 
      Excerpt: 
      Three-dimensional integrated circuits.
      Cover image for Fundamentals of silicon carbide technology : growth, characterization, devices and applications
      5. 
      Fundamentals of silicon carbide technology : growth, characterization, devices and applications
      by 
      Kimoto, Tsunenobu, 1963- author.
      Click to View
      Format: 
      Excerpt: 
      Integrated circuits.
      Cover image for Professional embedded arm development
      6. 
      Professional embedded arm development
      by 
      Langbridge, James A.
      Click to View
      Format: 
      Excerpt: 
      Integrated circuits.
      Cover image for New approaches to image processing based failure analysis of nano-scale ULSI devices
      7. 
      New approaches to image processing based failure analysis of nano-scale ULSI devices
      by 
      Zalevsky, Zeev.
      Click to View
      Format: 
      Excerpt: 
      Integrated circuits -- Ultra large scale integration -- Testing.
      Cover image for Control components using Si, GaAs, and GaN technologies
      8. 
      Control components using Si, GaAs, and GaN technologies
      by 
      Bahl, I. J., author.
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      Format: 
      Excerpt: 
      Radio frequency integrated circuits.
      Cover image for Network processor design : issues and practices
      9. 
      Network processor design : issues and practices
      by 
      Crowley, Patrick, 1974-
      ScienceDirect http://www.sciencedirect.com/science/book/9781558608757
      Format: 
      Excerpt: 
      Application-specific integrated circuits.
      Cover image for Silicon molecular beam epitaxy : proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
      10. 
      Silicon molecular beam epitaxy : proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
      by 
      International Symposium on Silicon Molecular Beam Epitaxy (3rd : 1989 : Strasbourg, France)
      ScienceDirect http://www.sciencedirect.com/science/book/9780444886200
      ScienceDirect https://www.sciencedirect.com/science/book/9780444886200
      Format: 
      Excerpt: 
      SiGe alloys (S.S. Iyer et al.). Silicon-based millimeter-wave integrated circuits (J-F. Luy
      Cover image for A Study on the Relationship of Processing Conditions, Microstructure and Properties of Copper Wirebond in Microelectronic Connections
      11.