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by
Pandian, Guru Prasad, author. (orcid)0000-0002-4291-4535
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electronic assemblies. To address these concerns, 10 year old lead-free systems were examined to determine
by
Collins, Ivel Lee, author.
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AM processes and materials are available, but their capability to produce features desirable for
by
Yang, Zhi, author.
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conductive materials are preferred to effectively dissipate heat generated inside system. On the other hand
by
Espalin, David, Jr., author.
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, thermomechanical simulations, and development of new materials are being addressed by other research efforts, the
by
Ren, Ren, author. (orcid)0000-0001-9157-092X
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Excerpt:
interest recently for energy and environmental applications due to their exceptional structural, electronic

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