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University of Minnesota. Electrical Engineering. degree granting institution.

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Alioto, Massimo. editor.

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Aluf, Ofer. author.

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Bai, Siqi, author.

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Brito, Nuno Andre Mano, author.

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Cakir, Burcin, author.

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Colorado State University. Electrical and Computer Engineering. degree granting institution.

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Dartmouth College. Engineering. degree granting institution.

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Hong Kong University of Science and Technology (Hong Kong). degree granting institution.

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Michigan Technological University. Electrical & Computer Engineering. degree granting institution.

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Missouri University of Science and Technology. Electrical Engineering. degree granting institution.

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Ng, Jimmy, author.

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Princeton University. Electrical Engineering. degree granting institution.

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Purdue University. Electrical and Computer Engineering. degree granting institution.

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Takhti, Mohammad, author.

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Universidade do Minho (Portugal). degree granting institution.

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University of Arkansas. Electrical Engineering. degree granting institution.

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University of California, Los Angeles. Materials Science and Engineering 0328. degree granting institution.

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Williams, J.B. author.

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Wong, Chien-Heng, author.

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Cover image for Design and Characterization Techniques for Reliable and Secure Integrated Circuits

Design and Characterization Techniques for Reliable and Secure Integrated Circuits

1.

Design and Characterization Techniques for Reliable and Secure Integrated Circuits

by

Tang, Qianying, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10255960

Format:

Excerpt:

Design and Characterization Techniques for Reliable and Secure Integrated Circuits / Tang, Qianying

Cover image for Fast Very-large-scale Integrated (VLSI) Circuits Simulations

Fast Very-large-scale Integrated (VLSI) Circuits Simulations

2.

Fast Very-large-scale Integrated (VLSI) Circuits Simulations

by

Zhao, Xueqian, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10791659

Format:

Excerpt:

Fast Very-large-scale Integrated (VLSI) Circuits Simulations / Zhao, Xueqian, author.

Cover image for Enabling the Internet of Things From Integrated Circuits to Integrated Systems

Enabling the Internet of Things From Integrated Circuits to Integrated Systems

3.

Enabling the Internet of Things From Integrated Circuits to Integrated Systems

by

Alioto, Massimo. editor.

http://dx.doi.org/10.1007/978-3-319-51482-6

Format:

Excerpt:

Enabling the Internet of Things From Integrated Circuits to Integrated Systems / Alioto, Massimo

Cover image for A Novel Power Integrity Modeling Method Based on Plane Pair PEEC

A Novel Power Integrity Modeling Method Based on Plane Pair PEEC

4.

A Novel Power Integrity Modeling Method Based on Plane Pair PEEC

by

Bai, Siqi, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10744238

Format:

Excerpt:

circuits. A novel modeling mothed, i.e. the plane pair PEEC method is proposed in this thesis to model the

Cover image for Addressing Integrated Circuit Integrity Using Statistical Analysis and Machine Learning Techniques

Addressing Integrated Circuit Integrity Using Statistical Analysis and Machine Learning Techniques

5.

Addressing Integrated Circuit Integrity Using Statistical Analysis and Machine Learning Techniques

by

Cakir, Burcin, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10824059

Format:

Excerpt:

Outsourcing of design and manufacturing processes makes integrated circuits (ICs) vulnerable to

Cover image for DPLL and Energy Harvesting Circuit for Low-Power and Miniaturized System Applications

DPLL and Energy Harvesting Circuit for Low-Power and Miniaturized System Applications

6.

DPLL and Energy Harvesting Circuit for Low-Power and Miniaturized System Applications

by

Wong, Chien-Heng, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10827411

Format:

Excerpt:

introduces a fully integrated CMOS dual source adaptive thermoelectric and RF energy harvesting circuit with

Cover image for Accurate Dimension Reduction Based Polynomial Chaos Approach for Uncertainty Quantification of High Speed Networks

Accurate Dimension Reduction Based Polynomial Chaos Approach for Uncertainty Quantification of High Speed Networks

7.

Accurate Dimension Reduction Based Polynomial Chaos Approach for Uncertainty Quantification of High Speed Networks

by

Krishna Prasad, Aditi, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10785345

Format:

Excerpt:

-level behavior of integrated circuits. As a result, there is a need for contemporary circuit simulation tools

Cover image for The Electronics Revolution Inventing the Future

The Electronics Revolution Inventing the Future

8.

The Electronics Revolution Inventing the Future

by

Williams, J.B. author.

http://dx.doi.org/10.1007/978-3-319-49088-5

Format:

Excerpt:

fundamental devices, and integrated circuits, through radio and television, to computers, mobile telephones

Cover image for Design of CMOS RFIC Ultra-Wideband Impulse Transmitters and Receivers

Design of CMOS RFIC Ultra-Wideband Impulse Transmitters and Receivers

9.

Design of CMOS RFIC Ultra-Wideband Impulse Transmitters and Receivers

by

Nguyen, Cam. author.

http://dx.doi.org/10.1007/978-3-319-53107-6

Format:

Excerpt:

frontends, operating within the 3.1-10.6 GHz frequency band, using CMOS radio-frequency integrated-circuits

Cover image for Microwave RF Antennas and Circuits Nonlinearity Applications in Engineering

Microwave RF Antennas and Circuits Nonlinearity Applications in Engineering

10.

Microwave RF Antennas and Circuits Nonlinearity Applications in Engineering

by

Aluf, Ofer. author.

http://dx.doi.org/10.1007/978-3-319-45427-6

Format:

Excerpt:

transistors (FETs), IMPATT amplifiers, Small Signal (SS) amplifiers, Bias-T circuits, PIN diode circuits

Cover image for Efficient test strategies for multi-level differential current mode logic

Efficient test strategies for multi-level differential current mode logic

11.

Efficient test strategies for multi-level differential current mode logic

by

Jackson, David L., author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10870943

Format:

Excerpt:

particular test requirements of MDCML designs and DV arrays. The physical failure modes of bipolar circuits

Cover image for Tunneling Transistors from 2D Crystals for Low-Power Electronic Applications

Tunneling Transistors from 2D Crystals for Low-Power Electronic Applications

12.

Tunneling Transistors from 2D Crystals for Low-Power Electronic Applications

by

Prakash, Abhijith, author.

http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10790845

Format:

Excerpt:

In the past, failure to handle heat dissipation in the integrated circuits (ICs) employing bipolar

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