Search ResultsElectronic Resources 
by
Dixon, John M. author.
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Engineering Thermodynamics, Heat and Mass Transfer.
by
Zhu, Pu, author.
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application of 3D printing has been expanded to various areas, such as automotive, aerospace and bio-engineering
by
Gribbin, Sean, author.
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International are tested at strain amplitudes from 0.6% to 1.4% engineering strain. These data are correlated to
by
Gasbarri, Federico, author.
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applications, e.g.: in the electronics, we need superfast chips that can dissipate heat and conduct electricity

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