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2017
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      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      1. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
      2. 
      Modern Aspects of Josephson Dynamics and Superconductivity Electronics
      by 
      Askerzade, Iman. author.
      http://dx.doi.org/10.1007/978-3-319-48433-4
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Fracture Mechanics of Piezoelectric Solids with Interface Cracks
      3. 
      Fracture Mechanics of Piezoelectric Solids with Interface Cracks
      by 
      Govorukha, Volodymyr. author.
      http://dx.doi.org/10.1007/978-3-319-53553-1
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Piezoelectric MEMS Resonators
      4. 
      Piezoelectric MEMS Resonators
      by 
      Bhugra, Harmeet. editor.
      http://dx.doi.org/10.1007/978-3-319-28688-4
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Materials for Advanced Packaging
      5. 
      Materials for Advanced Packaging
      by 
      Lu, Daniel. editor.
      http://dx.doi.org/10.1007/978-3-319-45098-8
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Power GaN Devices Materials, Applications and Reliability
      6. 
      Power GaN Devices Materials, Applications and Reliability
      by 
      Meneghini, Matteo. editor.
      http://dx.doi.org/10.1007/978-3-319-43199-4
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.