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Subject: Electronics.

Author

SpringerLink (Online service)

(7)

Askerzade, Iman. author.

(1)

Bhugra, Harmeet. editor.

(1)

Bozbey, Ali. author.

(1)

Cantürk, Mehmet. author.

(1)

Govorukha, Volodymyr. author.

(1)

Goyal, Deepak. editor.

(1)

Kamlah, Marc. author.

(1)

Kuang, Ken. editor.

(1)

Lapusta, Yuri. author.

(1)

Li, Yan. editor.

(1)

Loboda, Volodymyr. author.

(1)

Lu, Daniel. editor.

(1)

Meneghesso, Gaudenzio. editor.

(1)

Meneghini, Matteo. editor.

(1)

Piazza, Gianluca. editor.

(1)

Sturdivant, Rick. editor.

(1)

Swingler, Jonathan, editor.

(1)

Turner, Leslie William.

(1)

Wong, C.P. editor.

(1)

Zanoni, Enrico. editor.

(1)

Material Type

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(9)

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-

(7)

(1)

(1)

Subject

Electronics and Microelectronics, Instrumentation.

(7)

Microelectronics.

(7)

Electronic materials.

(6)

(6)

Optical and Electronic Materials.

(6)

Optical materials.

(6)

Electronic circuits.

(4)

Nanotechnology and Microengineering.

(3)

Nanotechnology.

(3)

Circuits and Systems.

(2)

Electronic Circuits and Devices.

(2)

Electronic books.

(2)

Metallic Materials.

(2)

(2)

Semiconductors.

(2)

(1)

Continuum Mechanics and Mechanics of Materials.

(1)

Continuum mechanics.

(1)

Digital electronics.

(1)

Electronic equipment

(1)

Electronics -- Handbooks, manuals, etc.

(1)

Energy systems.

(1)

Handbooks and manuals.

(1)

Microengineering.

(1)

Microwaves, RF and Optical Engineering.

(1)

(1)

Optical engineering.

(1)

(1)

Power Electronics, Electrical Machines and Networks.

(1)

Power electronics.

(1)

Strongly Correlated Systems, Superconductivity.

(1)

Superconductivity.

(1)

Superconductors.

(1)

TECHNOLOGY & ENGINEERING -- Mechanical.

(1)

Library

Başkent Library

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Elsevier E-Book Collections

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Cover image for Reliability characterisation of electrical and electronic systems

Reliability characterisation of electrical and electronic systems

1.

Reliability characterisation of electrical and electronic systems

by

Swingler, Jonathan, editor.

Format:

Excerpt:

Woodhead Publishing Series in Electronic and Optical Materials ;

Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics

Modern Aspects of Josephson Dynamics and Superconductivity Electronics

2.

Modern Aspects of Josephson Dynamics and Superconductivity Electronics

by

Askerzade, Iman. author.

http://dx.doi.org/10.1007/978-3-319-48433-4

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Materials for Advanced Packaging

Materials for Advanced Packaging

3.

Materials for Advanced Packaging

by

Lu, Daniel. editor.

http://dx.doi.org/10.1007/978-3-319-45098-8

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for 3D Microelectronic Packaging From Fundamentals to Applications

3D Microelectronic Packaging From Fundamentals to Applications

4.

3D Microelectronic Packaging From Fundamentals to Applications

by

Li, Yan. editor.

http://dx.doi.org/10.1007/978-3-319-44586-1

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Fracture Mechanics of Piezoelectric Solids with Interface Cracks

Fracture Mechanics of Piezoelectric Solids with Interface Cracks

5.

Fracture Mechanics of Piezoelectric Solids with Interface Cracks

by

Govorukha, Volodymyr. author.

http://dx.doi.org/10.1007/978-3-319-53553-1

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Piezoelectric MEMS Resonators

Piezoelectric MEMS Resonators

6.

Piezoelectric MEMS Resonators

by

Bhugra, Harmeet. editor.

http://dx.doi.org/10.1007/978-3-319-28688-4

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for Power GaN Devices Materials, Applications and Reliability

Power GaN Devices Materials, Applications and Reliability

7.

Power GaN Devices Materials, Applications and Reliability

by

Meneghini, Matteo. editor.

http://dx.doi.org/10.1007/978-3-319-43199-4

Format:

Excerpt:

Optical and Electronic Materials.

Cover image for RF and Microwave Microelectronics Packaging II

RF and Microwave Microelectronics Packaging II

8.

RF and Microwave Microelectronics Packaging II

by

Kuang, Ken. editor.

http://dx.doi.org/10.1007/978-3-319-51697-4

Format:

Excerpt:

electronic packaging and high-frequency electronics domain, and to academic researchers interested in

Cover image for Electronics engineer's reference book

Electronics engineer's reference book

9.

Electronics engineer's reference book

by

Turner, Leslie William.

ScienceDirect https://www.sciencedirect.com/science/book/9780408001687

Format:

Excerpt:

troposphere; references; further reading; chapter 6. electronic materials and components; resistive materials

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