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      Cover image for Power GaN Devices Materials, Applications and Reliability
      1. 
      Power GaN Devices Materials, Applications and Reliability
      by 
      Meneghini, Matteo. editor.
      http://dx.doi.org/10.1007/978-3-319-43199-4
      Format: 
      Excerpt: 
      Power GaN Devices Materials, Applications and Reliability / Meneghini, Matteo. editor.
      Cover image for Piezoelectric MEMS Resonators
      2. 
      Piezoelectric MEMS Resonators
      by 
      Bhugra, Harmeet. editor.
      http://dx.doi.org/10.1007/978-3-319-28688-4
      Format: 
      Excerpt: 
      Implementation of Piezoelectric MEMS Resonators -- Reliability and Quality Assessment (Stability and Packages
      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      3. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      .-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures
      Cover image for Materials for Advanced Packaging
      4. 
      Materials for Advanced Packaging
      by 
      Lu, Daniel. editor.
      http://dx.doi.org/10.1007/978-3-319-45098-8
      Format: 
      Excerpt: 
      Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New
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