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      Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
      1. 
      3D Microelectronic Packaging From Fundamentals to Applications
      by 
      Li, Yan. editor.
      http://dx.doi.org/10.1007/978-3-319-44586-1
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Materials for Advanced Packaging
      2. 
      Materials for Advanced Packaging
      by 
      Lu, Daniel. editor.
      http://dx.doi.org/10.1007/978-3-319-45098-8
      Format: 
      Excerpt: 
      Electronics and Microelectronics, Instrumentation.
      Cover image for Laser Beam Micro-milling of Micro-channels in Aerospace Alloys
      3. 
      Laser Beam Micro-milling of Micro-channels in Aerospace Alloys
      by 
      Darwish, Saied Muhammed Hassan. editor.
      http://dx.doi.org/10.1007/978-981-10-3602-6
      Format: 
      Excerpt: 
      frequently used in various industries such as aerospace, automotive, biomedical and micro-electronics.
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