Search Results for Reliability. - Narrowed by: Electronic packaging. SirsiDynix Enterprise http://katalog.baskent.edu.tr/client/en_US/default/default/qu$003dReliability.$0026qf$003dSUBJECT$002509Subject$002509Electronic$002bpackaging.$002509Electronic$002bpackaging.$0026ps$003d300?dt=list 2026-09-28T06:23:36Z Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging ent://SD_ILS/0/SD_ILS:935050 2026-09-28T06:23:36Z 2026-09-28T06:23:36Z by&#160;Bailey, Christopher.<br/><a href="https://ebookcentral.proquest.com/lib/baskent-ebooks/detail.action?docID=267393">Click to View</a><br/>Format:&#160;Electronic Resources<br/> Adhesives technology for electronic applications : materials, processes, reliability ent://SD_ILS/0/SD_ILS:1190016 2026-09-28T06:23:36Z 2026-09-28T06:23:36Z by&#160;Licari, James J., 1930-<br/>ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780815515135">http://www.sciencedirect.com/science/book/9780815515135</a><br/>Format:&#160;Electronic Resources<br/> LED packaging for lighting applications design, manufacturing, and testing ent://SD_ILS/0/SD_ILS:986705 2026-09-28T06:23:36Z 2026-09-28T06:23:36Z by&#160;Liu, S. (Sheng), 1963-<br/><a href="https://ebookcentral.proquest.com/lib/baskent-ebooks/detail.action?docID=818630">Click to View</a><br/>Format:&#160;Electronic Resources<br/> Hermeticity of electronic packages ent://SD_ILS/0/SD_ILS:1190068 2026-09-28T06:23:36Z 2026-09-28T06:23:36Z by&#160;Greenhouse, Hal.<br/>ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780815514350">http://www.sciencedirect.com/science/book/9780815514350</a><br/>Format:&#160;Electronic Resources<br/> Hermeticity of electronic packages ent://SD_ILS/0/SD_ILS:137264 2026-09-28T06:23:36Z 2026-09-28T06:23:36Z by&#160;Greenhouse, Hal.<br/>ScienceDirect <a href="http://www.sciencedirect.com/science/book/9781437778779">An electronic book accessible through the World Wide Web; click for information</a><br/>Format:&#160;Electronic Resources<br/> Reflow soldering processes : SMT, BGA, CSP and flip chip technologies ent://SD_ILS/0/SD_ILS:1187861 2026-09-28T06:23:36Z 2026-09-28T06:23:36Z by&#160;Lee, Ning-Cheng.<br/>ScienceDirect <a href="http://www.sciencedirect.com/science/book/9780750672184">http://www.sciencedirect.com/science/book/9780750672184</a> ScienceDirect <a href="https://www.sciencedirect.com/science/book/9780750672184">https://www.sciencedirect.com/science/book/9780750672184</a><br/>Format:&#160;Electronic Resources<br/>