Measurement Science and Manufacturing Science Research -- Nondestructive SEM for Surface and Subsurface Wafer Imaging -- Surface Inspection-Research and Development -- Wafer Level Reliability for High-Performance VLSI Design -- Wafer Level Reliability Testing: an Idea Whose Time Has Come -- Micro-Focus X-Ray Imaging -- Measurement of Opaque Film Thickness -- Intelligent Laser Soldering Inspection and Process Control -- Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits -- Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement -- Whole Wafer Scanning Electron Microscopy.