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Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental and Health Effects
Başlık:
Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental and Health Effects
Yazar:
Razgaleh, Sara, author.
ISBN:
9780355983968
Yazar Ek Girişi:
Fiziksel Tanımlama:
1 electronic resource (137 pages)
Genel Not:
Source: Dissertation Abstracts International, Volume: 79-10(E), Section: B.
Advisors: Shyam Aravamudhan Committee members: Jeffrey Alston; Narayan Bhattarai; Ajit Kelkar; Dennis Lajeunesse; James Ryan.
Özet:
Recent advancement in in integrated circuit (IC) technology alongside with development in fabrication technologies has resulted in smaller and higher density chips. As a result, there is a high demand for higher heat flux transport and improved thermal transfer in electronics packaging. The thermal stress that is generated by the excess heat in electronics packaging results in failure and fatigue of the components. This thermal stress is initiated by the mismatch in the coefficient of thermal expansion (CTE) of electronics components, here between the chip and the substrate. To address this problem underfill adhesive are used in packaging to reduce CTE mismatch and to facilitate thermal transport. Having a suitable thermal management throughout the package allows for a longer lifetime, reduces the mechanical and thermal stress, and therefore failure in performance. To achieve a specific heat and thermal transfer in the electronics, epoxy resin polymer properties are tailored. Moreover, we can readily incorporate other particles (known as filler) in the epoxy matrix to further enhance its properties. Nanotechnology has opened door to many unknown possibilities. In this research work we are exploring the application of nanometer size fillers in electronics packaging applications. At smaller dimension materials exhibit different properties due to their unique surface properties, therefore can affect matrix environment uniquely. Current challenges in microelectronics industry may be addressed using nanoparticles due to their enhanced properties. The potential of nanofillers in thermal management and heat transfer capability is yet to be fully investigated and be understood. In this research, hexagonal boron nitride (hBN) is used as nanofiller due its unique properties including higher thermal conductivity compared to other filler particles, such as silica. Hexagonal boron nitride particles of various sizes (70 nm, 500 nm and 1.5 mum) were used to study the effects of particle size (and surface to volume ratio) on the thermal properties of the underfill. Although the small dimensions of nanoparticles gives them their superior properties compare to larger particle size, It is also the origin of their toxicity impact. The current increase in nanoparticle usage has raised a global concern on human safety and environmental toxicity of these particles during their life time and at the end of life cycle such as after their disposal. Fate of these hBN nanoparticles used in microelectronics packaging is further studied by performing end-of-life cycle assessment on pristine and engineered nanoparticles that are produced by the electronic waste recycling process. Their chemical and physical properties are investigated after their disposal using a thermal degradation recycling method. Furthermore, to understanding the physiochemical transformation of these nanoparticles, their interaction with biological systems is studied. By the end of this research work, we hope to have obtained a full life cycle understanding of these particles from their application and use in microelectronics packaging to their physiochemical transformation during the recycling process, as well as, their cytotoxicity impact due to the occupational exposure (inhalation).
Notlar:
School code: 1544
Tüzel Kişi Ek Girişi:
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Yer Numarası | Demirbaş Numarası | Shelf Location | Lokasyon / Statüsü / İade Tarihi |
---|---|---|---|
XX(679196.1) | 679196-1001 | Proquest E-Tez Koleksiyonu | Arıyor... |
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