Front Cover; Advances in Imaging and Electron Physics, Volume 102; Copyright Page; Contents; Contributors; Preface; Chapter 1. Finite Element Methods for the Solution of 3D Eddy Current Problems; I. Introduction; II. Field Equations and Material Properties; III. Fields, Potentials, and Gauges; IV. Edge Elements for 3D Field Problems and Vector Potentials; V. Integral Formulations for Linear and Nonlinear Eddy Currents; VI. Differential Formulations and Constitutive Error Approach; VII. Discussion and Conclusions; References; Chapter 2. Nanofabrication for Electronics; I. Introduction

II. Nanofabrication MethodsIII. Pattern Transfer; IV. Resolution Limit of Organic Resists; V. Applications of Nanostructures; VI. Conclusion; References; Chapter 3. Miniature Electron Optics; I. Introduction; II. Scaling Laws for Electrostatic Lenses; III. Fabrication of Miniature Electrostatic Lenses; IV. Fabrication of Miniature Magnetostatic Lenses; V. Electron Source; VI. Detector; VII. Electron Optical Calculations; VIII. Performance of a Stacked Einzel Lens; IX. Summary and Future Prospects; References; Chapter 4. Optical Interconnection Networks; I. Introduction

II. Optical Interconnect TypesIII. Architectures; IV. Applications; V. Packaging of Optical Interconnects; VI. Problems and Possibilities; VII. Conclusions; References; Chapter 5. Aspects of Mirror Electron Microscopy; I. Resolution of the Mirror Electron Microscope; II. Distortion of Details of Object Image under Observation in a Mirror Electron Microscope; III. Limiting Sensitivity of a Mirror Electron Microscope for Observation of Steps on an Object; VI. Image of Islands on an Object Surface in Mirror Electron Microscopy

V. Calculation of Image Contrast in a Mirror Electron Microscope in the Focused Operation ModeReferences; Index