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A Study on the Relationship of Processing Conditions, Microstructure and Properties of Copper Wirebond in Microelectronic Connections
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A Study on the Relationship of Processing Conditions, Microstructure and Properties of Copper Wirebond in Microelectronic Connections
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Liu, Dong, author.
http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqm&rft_dat=xri:pqdiss:10903358
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Detection and Diagnosis of Electrical Faults in Induction Motors Using Instantaneous Phase Variation
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Detection and Diagnosis of Electrical Faults in Induction Motors Using Instantaneous Phase Variation
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A Mechanical Interpretation of the Electrical Breakdown of Polymeric Insulation
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A Mechanical Interpretation of the Electrical Breakdown of Polymeric Insulation
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