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by
Ouvarov-Bancalero, Valery Georges, author.
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Alıntı:
quality and reliability issues arose. Copper (Cu) wire to aluminum (Al) bond-pad is prone to crack
by
Reeve, Thomas C., author.
Format:
Alıntı:
properties and reliability through IMC structural and morphological coordination. (Abstract shortened by
by
Yang, Lin, author.
Format:
Alıntı:
stress. The stochastic behaviors of the multi-site fatigue crack initiation and the reliability of

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