Search ResultsElektronik Kaynaklar
by
Karri, Naveen Kishore, author. (orcid)0000-0002-7381-9047
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Reliable Thermoelectric System Design under Optimal Requirements from the Structural and
by
Wang, Sheng, author.
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frames of videos. Exploiting the clustered property, we design an effective structural aware
by
Lin, Ruiyang, author.
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electromagnetic, structural, and thermal analyses. The electromagnetic analysis combines the advantage of an
by
Anyanhun, Awele Ifeyinwa, author.
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system design equipped with inter-satellite communication capability for high-speed data relay. In this
by
Zeppettella, David L., author.
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structural integration perspective and is unacceptable at UHF frequencies. While RF absorbing materials have
by
Kimura, Adam G., author.
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hardware integrity. The Design Integrity (DI) analysis parses the design out into five sub-domain profiles





