Search Results for Packaging.

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Materials for Advanced Packaging

Lu, Daniel. editor.

http://dx.doi.org/10.1007/978-3-319-45098-8

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Materials for Advanced Packaging Lu, Daniel. editor.

RF and Microwave Microelectronics Packaging II

Kuang, Ken. editor.

http://dx.doi.org/10.1007/978-3-319-51697-4

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RF and Microwave Microelectronics Packaging II Kuang, Ken. editor.

3D Microelectronic Packaging From Fundamentals to Applications

Li, Yan. editor.

http://dx.doi.org/10.1007/978-3-319-44586-1

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3D Microelectronic Packaging From Fundamentals to Applications / Li, Yan. editor.

Fundamentals of Electronic Systems Design

Lienig, Jens. author.

http://dx.doi.org/10.1007/978-3-319-55840-0

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system levels, assembly and packaging issues and appliance protection classes, reliability analysis

Nanovate Commercializing Disruptive Nanotechnologies

Anis, Mohab. author.

http://dx.doi.org/10.1007/978-3-319-44863-3

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Alıntı:

Applications -- Textile Applications -- Sports Equipment -- Nutraceutical Industry -- Packaging Applications

Nanometer CMOS ICs From Basics to ASICs

J.M. Veendrick, Harry. author.

http://dx.doi.org/10.1007/978-3-319-47597-4

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Alıntı:

Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug

Wireless Power Transfer and Data Communication for Neural Implants Case Study: Epilepsy Monitoring

Yilmaz, Gürkan. author.

http://dx.doi.org/10.1007/978-3-319-49337-4

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Alıntı:

-- Packaging of the Implant -- System Level Experiments and Results -- Conclusion.

Enabling the Internet of Things From Integrated Circuits to Integrated Systems

Alioto, Massimo. editor.

http://dx.doi.org/10.1007/978-3-319-51482-6

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Alıntı:

packaging and assembly of IoT integrated systems (on silicon and non-silicon substrates). As a common thread

Proceedings of the International Conference on Nano-electronics, Circuits & Communication Systems

Nath, Vijay. editor.

http://dx.doi.org/10.1007/978-981-10-2999-8

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Alıntı:

Analysis of Embedded Systems for GSM Applications -- 25. IC Packaging: 3D IC Technology & Methods -- 26

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