Search Results for Packaging.

Eylem Seç

Ayırt
Listelerime ekle
Eposta
Yazdır

7 sonuç bulundu

0000000DEFAULTTR

Liste seç

Bunu varsayılan liste yap.

Öğeler başarıyla eklendi

Öğeler eklenirken hata oldu. Lütfen tekrar deneyiniz.

Materials for Advanced Packaging

Lu, Daniel. editor.

http://dx.doi.org/10.1007/978-3-319-45098-8

Format:

Alıntı:

Materials for Advanced Packaging Lu, Daniel. editor.

RF and Microwave Microelectronics Packaging II

Kuang, Ken. editor.

http://dx.doi.org/10.1007/978-3-319-51697-4

Format:

Alıntı:

RF and Microwave Microelectronics Packaging II Kuang, Ken. editor.

3D Microelectronic Packaging From Fundamentals to Applications

Li, Yan. editor.

http://dx.doi.org/10.1007/978-3-319-44586-1

Format:

Alıntı:

3D Microelectronic Packaging From Fundamentals to Applications / Li, Yan. editor.

Nanometer CMOS ICs From Basics to ASICs

J.M. Veendrick, Harry. author.

http://dx.doi.org/10.1007/978-3-319-47597-4

Format:

Alıntı:

Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug

Wireless Power Transfer and Data Communication for Neural Implants Case Study: Epilepsy Monitoring

Yilmaz, Gürkan. author.

http://dx.doi.org/10.1007/978-3-319-49337-4

Format:

Alıntı:

-- Packaging of the Implant -- System Level Experiments and Results -- Conclusion.

Microjoining and nanojoining

Zhou, Y.

ScienceDirect http://www.sciencedirect.com/science/book/9781845691790

Format:

Alıntı:

microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many

Hermeticity testing of MEMS and microelectronic packages

Costello, Suzanne, author.

Click to View

Format:

Alıntı:

: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity

	{displayName}	{count}
{error}