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      Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging için kapak resmi
      1. 
      Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging
      by 
      Bailey, Christopher.
      Click to View
      Format: 
      Alıntı: 
      electronics packaging Bailey, Christopher.
      Adhesives technology for electronic applications : materials, processes, reliability için kapak resmi
      2. 
      Adhesives technology for electronic applications : materials, processes, reliability
      by 
      Licari, James J., 1930-
      ScienceDirect http://www.sciencedirect.com/science/book/9780815515135
      Format: 
      Alıntı: 
      TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
      Hermeticity of electronic packages için kapak resmi
      3. 
      Hermeticity of electronic packages
      by 
      Greenhouse, Hal.
      ScienceDirect An electronic book accessible through the World Wide Web; click for information
      Format: 
      Alıntı: 
      Electronics -- Materials -- Permeability.
      Hermeticity of electronic packages için kapak resmi
      4. 
      Hermeticity of electronic packages
      by 
      Greenhouse, Hal.
      ScienceDirect http://www.sciencedirect.com/science/book/9780815514350
      Format: 
      Alıntı: 
      TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.
      Reflow soldering processes : SMT, BGA, CSP and flip chip technologies için kapak resmi
      5. 
      Reflow soldering processes : SMT, BGA, CSP and flip chip technologies
      by 
      Lee, Ning-Cheng.
      ScienceDirect http://www.sciencedirect.com/science/book/9780750672184
      ScienceDirect https://www.sciencedirect.com/science/book/9780750672184
      Format: 
      Alıntı: 
      TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.