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    Öğeler eklenirken hata oldu. Lütfen tekrar deneyiniz.
      by 
      Cui, Yinan. author.
      Format: 
      Alıntı: 
      presented in this thesis yield valuable new guidelines for microdevice design, reliability analysis and
      by 
      Li, Ting. editor.
      Format: 
      Alıntı: 
      designed via models and simulations, how to improve reliability, and what are the possible challenges and
      by 
      Bhushan, Bharat. editor.
      Format: 
      Alıntı: 
      reliability engineering knowledge in just one volume. Furthermore, it discusses various nanostructures; micro
      by 
      Bhugra, Harmeet. editor.
      Format: 
      Alıntı: 
      Implementation of Piezoelectric MEMS Resonators -- Reliability and Quality Assessment (Stability and Packages
      by 
      Lu, Daniel. editor.
      Format: 
      Alıntı: 
      Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New
      by 
      Li, Yan. editor.
      Format: 
      Alıntı: 
      .-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures
      by 
      Nath, Vijay. editor.
      Format: 
      Alıntı: 
      in Images -- 22. Reliability and Energy Benefit Analysis of Distribution System incorporating Wind
      by 
      Chen, Xiangfan, author. (orcid)0000-0002-5627-7530
      Format: 
      Alıntı: 
      scalability, reliability, and cost-effectiveness. For example, three-dimensional (3D) printing technologies