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by
Cui, Yinan. author.
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Alıntı:
presented in this thesis yield valuable new guidelines for microdevice design, reliability analysis and
by
Li, Ting. editor.
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designed via models and simulations, how to improve reliability, and what are the possible challenges and
by
Bhushan, Bharat. editor.
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reliability engineering knowledge in just one volume. Furthermore, it discusses various nanostructures; micro
by
Bhugra, Harmeet. editor.
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Implementation of Piezoelectric MEMS Resonators -- Reliability and Quality Assessment (Stability and Packages
by
Lu, Daniel. editor.
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Materials and Processing Perspective -- Flip-Chip Underfill: Materials, Process and Reliability -- New
by
Li, Yan. editor.
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Alıntı:
.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures
by
Nath, Vijay. editor.
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Alıntı:
in Images -- 22. Reliability and Energy Benefit Analysis of Distribution System incorporating Wind
by
Chen, Xiangfan, author. (orcid)0000-0002-5627-7530
Format:
Alıntı:
scalability, reliability, and cost-effectiveness. For example, three-dimensional (3D) printing technologies

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